Photonics Process Integration Expert

Further responsibilities

Foundry and Fab Engagement

• Lead technical discussions with multiple fabs and foundries on transferring Heterogeneous Integrated Silicon Photonics (HISP), our proprietary platform, into their high-volume manufacturing process lines.
• Assess process compatibility and define how HISP can be integrated with the high-volume processes and existing infrastructure.
• Own the technical roadmap for process evaluation and transfer, including risk assessment, gap analysis, and qualification planning.

Research Collaborations

• Lead the initiation and technical management of research contracts with leading research institutes and knowledge centers, continuing the generation of IP in support of HISP so we can transfer the technology further.
• Coordinate joint development activities that accelerate maturation of the HISP process towards a volume manufacturing facility.

Process Technology Ownership

• Provide in-depth expertise across the full photonic integrated circuit process flow, and interact with the design team to evolve the HISP platform according to adjusted customer requirements. 
• Take ownership of back-end-of-line (BEOL) metallization and wafer/die bonding process steps, which are critical to HISP.
• Drive process development from initial experiment through to validation, safeguarding and following up at each step so that it converges on the agreed performance, yield, and manufacturability targets.
• Document process definitions, transfer plans, and results, and align internal process needs with external manufacturing and equipment roadmaps. 

Qualifications

• Master’s degree or above in Photonics, Microelectronics, Materials Science, Electrical Engineering, Physics, or equivalent experience.
• At least 5 years of related experience in photonic or semiconductor process technology, ideally including fab or foundry interaction. 
• In-depth knowledge of PIC and semiconductor process steps, with demonstrated expertise in metal back end (BEOL) processing and bonding technologies.  
• Experience managing technology transfer and research collaborations with fabs, foundries, or research institutes.
• Familiarity with silicon photonics platforms and heterogeneous integration is a strong advantage.  
• Ability to work independently and to lead technical relationships across organizational boundaries in a fast-moving R&D environment. 
• Strong communication skills for cross-functional collaboration with suppliers, partners, and internal teams. 
• Ability to communicate in English, both written and spoken.

This role involves occasional travel to fab and partner sites. 

What Makes You Stand Out 

• Design or simulation experience: the ability to independently simulate process effects on device performance, which strengthens the interaction with the design team. 
• Experience with yield analysis and design for manufacturability (DFM).