The data center optical module market is characterized by continuous joint industry efforts to evolve the standards towards higher speeds. For leaf and spine switch interconnectivity, FR4 and DR4 modules become available that push the boundaries towards 800G per module and even higher.
Transceiver vendors compete to offer the longest optical module lifetime in harsh operating conditions, optimized price/performance ratios, and openness to new technologies. Photonic integration technology, built upon silicon indium-phosphide platforms, is gradually takes more market share.
Out solution of hybrid integration of mainstream low cost PIC technology with high speed TFLN modulator capabilities provide the pathway towards the next generation of data center pluggables. This compatibility facilitates seamless incorporation into existing architectures.
Several attributes make our technology the perfect candidate for data center applications
- High speed modulation that surpasses the performance of competing technologies
- Low cost manufacturing process suitable for mass production
- Simplifies assembly process for optical transceivers and improves yield
- Better signal integrity due to improved linearity and RF matching and low drive voltage
- Low power consumption and good efficiency thanks to the low optical insertion loss
- High reliability and stable performance under harsh operating conditions
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